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Arbitrary Modeling of TSVs for 3D Integrated Circuits formatIsbn:Hardcover - 9783319076102 Warum auf dem Bauernhof eingekauftThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for
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